Semiconductor device and manufacturing method thereof

ABSTRACT

The present invention makes it possible to obtain: a semiconductor device capable of forming a highly reliable upper wire without a harmful influence on the properties of the magnetic material for an MTJ device; and the manufacturing method thereof. Plasma treatment is applied with reducible NH 3  or H 2  as pretreatment. Thereafter, a tensile stress silicon nitride film to impose tensile stress on an MTJ device is formed over a clad layer and over an interlayer dielectric film where the clad layer is not formed. Successively, a compressive stress silicon nitride film to impose compressive stress on the MTJ device is formed over the tensile stress silicon nitride film. The conditions for forming the tensile stress silicon nitride film and the compressive stress silicon nitride film are as follows: a parallel plate type plasma CVD apparatus is used; the RF power is set in the range of 0.03 to 0.4 W/cm 2 ; and the film forming temperature is set in the range of 200° C. to 350° C.

CROSS-REFERENCE TO RELATED APPLICATIONS

The disclosure of Japanese Patent Application No. 2008-142534 filed onMay 30, 2008 including the specification, drawings and abstract isincorporated herein by reference in its entirety.

BACKGROUND OF THE INVENTION

The present invention relates to a semiconductor device having a memorydevice such as an MTJ (Magnetic Tunnel Junction) device, and a methodfor manufacturing the semiconductor device.

An MRAM is a memory to store data by using a magnetic substance in amemory device and controlling the orientation of the magnetization inthe magnetic substance, namely a memory to retain data by storinginformation in the spin of an electron, and the circuit is structured soas to be randomly accessible. There is an MTJ device as a memory deviceused in an MRAM. Here, the term “MTJ device” is used in theSpecification as a concept including a TMR (Tunneling MagnetoResistance) device.

An MTJ device is generally manufactured so as to be electrically coupledto an upper wire as a conductive layer formed over the MTJ device. Anexample of the structure having the upper wire and the manufacturingmethod thereof are the magnetic memory device and the manufacturingmethod thereof disclosed in Japanese Unexamined Patent Publication No.2007-53315.

SUMMARY OF THE INVENTION

As stated above, an MRAM uses a magnetic material as a memory device (anMTJ device). The wiring processes after the MTJ device is formed arerequired to be applied at a low temperature from the viewpoint of thethermal resistance in the magnetic property of the magnetic material.Consequently, it is desired that an upper wire such as a Cu wire isformed in a low temperature process.

It is concerned however that to form a Cu wire (an upper wire) at a lowtemperature undergoes the influence of the vulnerability or the like inthe quality of an interlayer dielectric film formed over the Cu wiresimilarly at a low temperature and influences the reliability of theupper wire.

The present invention has been established in order to solve the aboveproblems (concerns) and an object of the present invention is to obtaina semiconductor device allowing a highly reliable upper wire to formwithout rendering a harmful influence to the property of the magneticmaterial for an MTJ device, and the method for manufacturing thesemiconductor device.

In an embodiment according to the present invention, a silicon nitridefilm that is formed above an MTJ device section and formed over a cladlayer configuring an upper wiring section electrically coupled to theMTJ device section is configured by a layered structure comprising atensile stress silicon nitride film and a compressive stress siliconnitride film.

According to the embodiment, since both the tensile stress siliconnitride film and the compressive stress silicon nitride film can beformed by a manufacturing method of a relatively low power, the propertyof the magnetic film in an MTJ device section is prevented from beingadversely influenced by minimizing damages to the MTJ device section.

In addition, since the compressive stress silicon nitride film has thefunction of improving the reliability of the upper wiring section, theeffect of improving the reliability of the upper wiring section can beexhibited.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing a planar structure of an MTJ devicesection in an MRAM according to the first embodiment of the presentinvention.

FIG. 2 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 3 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 4 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 5 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 6 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 7 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 8 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 9 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 10 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 11 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 12 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 13 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 14 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 15 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 16 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 17 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 18 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 19 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 20 is a sectional view showing the manufacturing method of an MRAMaccording to the first embodiment.

FIG. 21 is a plan view showing a planar structure of a memory cellsection including a wiring structure according to the first embodiment.

FIGS. 22( a) to 22(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 23( a) to 23(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 24( a) to 24(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 25( a) to 25(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 26( a) to 26(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 27( a) to 27(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 28( a) to 28(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 29( a) to 29(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 30( a) to 30(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIGS. 31( a) to 31(c) are sectional views showing the manufacturingmethod of an MRAM according to the first embodiment.

FIG. 32 is an explanatory view showing an expanded structure in afocused region in a memory cell section in FIGS. 30( a) to 30(c).

FIG. 33 is a graph showing the relationship between RF power used when asilicon nitride film is formed over an upper wire in an MTJ device andthe switching current variation of the MTJ device.

FIGS. 34( a) to 34(c) are sectional views showing the structure of anMRAM according to the second embodiment of the present invention.

FIGS. 35( a) to 35(c) are sectional views showing the structure of anMRAM according to the third embodiment of the present invention.

FIGS. 36( a) to 36(c) are sectional views showing a modified example ofthe structure of an MRAM according to the third embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

FIG. 1 is a plan view showing a planar structure of a memory cellsection (a memory cell forming region) in an MRAM according to the firstembodiment of the present invention. As shown in the figure, a lowerelectrode EB1 having a rectangular shape in a plan view is formed abovea semiconductor substrate 100 and an MTJ device MD1 (an upper electrodeET1) having an oblong shape in a plan view is formed on the right sideover the lower electrode EB1. Further, a silicon nitride film 33 havinga rectangular shape identical to the lower electrode EB1 in a plan viewis formed so as to cover the MTJ device MD1. Furthermore, a via hole 40is formed in the center of the MTJ device MD1.

FIGS. 2 to 20 are sectional views showing the manufacturing method of anMRAM according to the first embodiment. Here, FIGS. 2 to 20 aresectional views taken on line A-A in FIG. 1. FIG. 21 is a plan viewshowing a planar structure of a memory cell section including a wiringstructure according to the first embodiment. FIGS. 22 to 31 aresectional views showing the manufacturing method of an MRAM according tothe first embodiment. Here, in each of FIGS. 22 to 31, (a) represents asectional view taken on line X-X in FIG. 21, (b) represents a sectionalview taken on line Y-Y in FIG. 21, and (c) represents a cross-sectionalstructure at a periphery circuit section different from a memory cellsection. A method for manufacturing an MRAM according to the firstembodiment is hereunder explained in reference to FIGS. 2 to 31.

Firstly as shown in FIG. 2, device isolation regions 2 are selectivelyformed at the upper layer part of a semiconductor substrate 100. Theupper layer part of the semiconductor substrate 100 between the deviceisolation regions 2, 2 acts as an active region 1 in which a transistorand others are formed.

Then as shown in FIG. 3, by introducing a first conductive typeimpurity, a well region 1 w is formed at the upper layer part of thesemiconductor substrate 100.

Successively as shown in FIG. 4, a gate dielectric film 11 is formedover the well region 1 w and a gate electrode 12 is selectively formedover the gate dielectric film 11. The surface of the well region 1 wunder the gate electrode 12 is defined as a channel region 1 c.

Subsequently as shown in FIG. 5, a second conductive type (an oppositeconductive type from the first conductive type) impurity is injected anddiffused into the gate electrode 12 in a self-aligned manner andthereafter a sidewall 13 of a double layered structure is formed overthe side face of the gate electrode 12. Thereafter, a pair ofsource/drain regions 14, 14 having extension regions in the vicinity ofthe channel region 1 c is formed by injecting and diffusing the secondconductive type impurity into the gate electrode 12 and the sidewall 13in a self-aligned manner. As a result, a MOS transistor Q1 comprisingthe channel region 1 c, the gate dielectric film 11, the gate electrode12, and the source/drain regions 14 is formed.

Successively as shown in FIG. 6, a silicide region 15 of CoSi or NiSifor example is formed on the surface of each of the source/drain regions14, 14 and the gate electrode 12.

Subsequently as shown in FIG. 7, an interlayer dielectric film 16 isformed over the whole surface and a contact plug 17 is selectivelyformed in the manner of penetrating through the interlayer dielectricfilm 16. The contact plug 17 is electrically coupled to the silicideregion 15 in one of the paired source/drain regions 14, 14.

Further as shown in FIG. 8, a nitride film 41 and an interlayerdielectric film 18 (as an oxide film) are layered over the whole surfaceand a Cu wire 19 is selectively formed in the manner of penetratingthrough the nitride film 41 and the interlayer dielectric film 18. As aresult, a part of the Cu wire 19 is electrically coupled to the contactplug 17. In this way, the Cu wire 19 is formed as a first layered metalwire.

Subsequently as shown in FIG. 9, a nitride film 42 and interlayerdielectric films 20 and 21 (as oxide films) are layered over the wholesurface and a fine hole 72 is selectively formed in the manner ofpenetrating through the nitride film 42 and the interlayer dielectricfilm 20. Further, a wiring hole 62 is selectively formed in the mannerof penetrating through the interlayer dielectric film 21 in the regionincluding the fine hole 72 and thereafter a Cu wire 22 is formed bybeing embedded in the fine hole 72 and the wiring hole 62. The Cu wire22 is electrically coupled to the Cu wire 19 (the Cu wire 19electrically coupled to the contact plug 17). In this way, the Cu wire22 is formed as a second layered metal wire by the damascene technology.

Thereafter as shown in FIG. 10, a nitride film 43 and interlayerdielectric films 23 and 24 (comprising oxide films) are formed over thewhole surface and a fine hole 73 is selectively formed in the manner ofpenetrating through the nitride film 43 and the interlayer dielectricfilm 23. Further, a wiring hole 63 is selectively formed in the mannerof penetrating through the interlayer dielectric film 24 in the regionincluding the fine hole 73. Thereafter, a clad layer 51 for magneticshield is formed over the side faces and the bottom faces of the wiringhole 63 and the fine hole 73 by the sputtering method. As theconstituent material of the clad layer 51, a material having a smallcoercive force and a small residual magnetization but having a magneticproperty linear to a magnetic field (cobalt, iron, nickel, etc. or achemical compound thereof (for example NiFe)) is desirable.

Then as shown in FIG. 11, the fine hole 73 and the wiring hole 63 arefilled and a Cu wire 25 (a lead wire 25 r and a digit line 25 d (a wordline)) is formed. Then the lead wire 25 r is electrically coupled to theCu wire 22. In this way, the Cu wire 25 as a third layered metal wireand the clad layer 51 are formed by the damascene technology.

Thereafter as shown in FIG. 12, an interlayer dielectric film 26including a silicon nitride film is formed over the whole surface and avia hole 9 is selectively formed in the manner of penetrating through apart in the region of the lead wire 25 r in the memory cell section.

Then as shown in FIG. 13, a barrier metal layer 28 is formed over thewhole surface including the interior of the via hole 9 and a viaembedded metal layer 29 is formed over the barrier metal layer 28.

Subsequently as shown in FIG. 14, CMP treatment is applied to thebarrier metal layer 28 and the via embedded metal layer 29 and only thebarrier metal layer 28 and the via embedded metal layer 29 in the viahole 9 are retained.

Thereafter as shown in FIG. 15, a lower electrode layer 30, an MTJ film31, and an upper electrode layer 32 are layered over the whole surface.Here, the lower electrode layer 30 and the upper electrode layer 32 useTa as the constituent material for example and are formed by thesputtering method for example.

Subsequently as shown in FIG. 16, the MTJ film 31 and the upperelectrode layer 32 are patterned with a patterned resist not shown inthe figure and an MTJ device MD1 and an upper electrode ET1 areobtained. The MTJ device MD1 and the upper electrode ET1 configure anMTJ device section.

Successively as shown in FIG. 17, a silicon nitride film 33 is formedover the whole surface including the MTJ device section (the MTJ deviceMD1 and the upper electrode ET1). As a result, the silicon nitride film33 is formed directly on the surface and the side face of the MTJ deviceMD1. Then a resist pattern 34 is selectively formed over the siliconnitride film 33 by a lithography technology.

Further as shown in FIG. 18, the silicon nitride film 33 and the lowerelectrode layer 30 are patterned by the dry etching technology by usingthe resist pattern 34 as a mask and thus the patterned silicon nitridefilm 33 and lower electrode EB1 are obtained.

In this way, the silicon nitride film 33 and the lower electrode layer30 are patterned simultaneously and hence the surface and the side faceof the MTJ device MD1 are protected by the silicon nitride film 33 whenthe lower electrode layer 30 is patterned. As a result, it is possibleto effectively inhibit electricity leak of the MTJ device MD1 caused bythe deposition of the residue of the lower electrode layer 30 onto theside face of the MTJ device MD1 from occurring. Here, since the siliconnitride film 33 and the lower electrode layer 30 are formed with anidentical mask, the same shape is obtained in a plan view within thevariation in the process.

FIG. 19 is an explanatory view showing an expanded structure of afocused region v1 in FIG. 18. Here, the silicon nitride film 33 is notshown in the figure. As shown in the figure, the MTJ device sectioncomprising the MTJ device MD1 and the upper electrode ET1 is obtainedover the lower electrode EB1. Here, the detailed structure of the MTJdevice MD1 takes a layered structure comprising a lower magnetic film 6(a pinned layer) comprising a ferromagnetic film such as an alloy filmor an amorphous film containing Co, Fe, and Ni for example, a tunneldielectric film 7 comprising Al₂O₃ or MgO for example, and an uppermagnetic film 8 (a free layer).

Then as shown in FIG. 20, an interlayer dielectric film 35 a (a firstdielectric region) comprising SiO₂ is formed over the whole surface inthe manner of covering the whole MTJ device section including thesilicon nitride film 33. On this occasion, in the memory cell section,even if hydrogen and moisture diffuse from the interlayer dielectricfilm 35 a, the existence of the silicon nitride film 33 makes itpossible to inhibit magnetic damages to the MTJ device MD1. Further, theinterlayer dielectric film 35 a is flattened by applying the CMPtreatment to the interlayer dielectric film 35 a.

Explanations are hereunder made in reference to the sectional views inFIGS. 22 to 31. Prior to the explanations referring to FIGS. 22 to 31, aplanar structure of an MRAM after the completion of an upper wire shownin FIG. 21 is explained.

As shown in FIG. 21, a lower electrode EB1 having a rectangular shape ina plan view is formed and an MTJ device MD1 (an upper electrode ET1)having an oblong shape in a plan view is formed on the right side of thelower electrode EB1. Further, a silicon nitride film 33 having the samerectangular shape as the lower electrode EB1 in a plan view is formedover the MTJ device MD1. Furthermore, a via hole 40 is formed in thecenter of the MTJ device MD1. Moreover, a via hole 9 is formed on theleft side of the lower electrode EB1 and is electrically coupled to alead wire 25 r below.

Further, a Cu wire 37 is formed as an upper wire (a bit line) in themanner of covering the whole lower electrode EB1 (the silicon nitridefilm 33) and passing in the transverse direction in the figure.Furthermore, a digit line 25 d is formed in the vertical direction inthe figure at a lower layer including the whole region where the MTJdevice MD1 is formed.

Then, the sectional view of the structure taken on line X-X in FIG. 21(the sectional view along the center line of the Cu wire 37 (over thevia holes 9 and 40) is shown as the views (a) in FIGS. 22 to 31, and thesectional view of the structure taken on line Y-Y in FIG. 21 (thesectional view along the center line of the digit line 25 d (over thevia hole 40) is shown as the views (b) in FIGS. 22 to 31.

Further, in each of the views (a) to (c) in FIGS. 22 to 31, thestructure of the upper part from the interlayer dielectric film 24 isshown and the layers lower than the interlayer dielectric film 24 arenot shown. Furthermore, in each of the views (a) and (b) in FIGS. 22 to31, two units of MTJ devices MD1 are shown and the structure of theinterlayer dielectric film 26 comprising the silicon nitride film 26 aand the silicon oxide film 26 b is shown. A method for manufacturing thestructure following the structure shown in FIG. 20 according to thefirst embodiment is hereunder explained in reference to FIGS. 22 to 31.

Firstly as shown in FIGS. 22( a) and 22(b), at the memory cell section,a via hole 40 is selectively formed above the upper electrode ET1 in themanner of penetrating through the silicon nitride film 33 and theinterlayer dielectric film 35 a. On this occasion, the silicon nitridefilm 33 functions as a stopper film when the interlayer dielectric film35 a is penetrated. Along with the formation of the via hole 40, a viahole 40 p is formed in the manner of penetrating through the interlayerdielectric film 35 a and the interlayer dielectric film 26 (the siliconnitride film 26 a and the silicon oxide film 26 b) at the peripherycircuit section (FIG. 22 (c)).

Successively as shown in FIGS. 23( a) and 23(b), a Cu wire 37 a isembedded into the via hole 40 at the memory cell section, and the Cuwire (a contact plug) 37 a is embedded into the via hole 40 p at theperiphery circuit section (FIG. 23( c)).

Subsequently as shown in FIGS. 24( a) to 24(c), an interlayer dielectricfilm 35 b (a second dielectric region) comprising SiO₂ or the like isformed over the whole surface for example by the HDP-CVD (High DensityPlasma Chemical Vapor Deposition) method at a low temperature of 300° C.or lower, and thereafter the interlayer dielectric film 35 b isflattened by applying the CMP treatment to the interlayer dielectricfilm 35 b. Thereafter as shown in FIGS. 24( a) to 24(c), a trench 36 isformed in the manner of selectively penetrating through the interlayerdielectric film 35 b at both the memory cell section (FIGS. 24( a) and24(b)) and the periphery circuit section (FIG. 24( c)). On thisoccasion, the trench 36 is formed so that the surface of the Cu wire 37a may be exposed.

Then as shown in FIGS. 25( a) to 25(c), a clad layer 53 a of aprescribed thickness for magnetic shielding is formed over the bottomface and the side face of the trench 36 and over the interlayerdielectric film 35 b by the sputtering method. Here, as the constituentmaterial for the clad layer 53 a, a material having the samecharacteristics as the clad layer 51 is desirable.

Thereafter as shown in FIGS. 26( a) to 26(c), the clad layer 53 a formedover the bottom face of the trench 36 and over the interlayer dielectricfilm 35 b is selectively removed by etch back.

Then as shown in FIGS. 27( a) to 27(c), a bit line is obtained byembedding a Cu wire 37 b into the trench 36 and forming the Cu wire 37b. As a result, the Cu wire 37 b at the memory cell section (FIGS. 27(a) and 27(b)) is electrically coupled to the upper electrode ET1 of theMTJ device MD1 through the Cu wire 37 a. In the same way, the Cu wire 37b at the periphery circuit section (FIG. 27( c)) is electrically coupledto the Cu wire 25 through the Cu wire 37 a. In this way, the Cu wire 37(37 a and 37 b) functioning as a fourth layered metal wire and a mainwiring section is formed. Here, the Cu wire 37 may also be formedintegrally by dual damascene.

Thereafter as shown in FIGS. 28( a) to 28(c), a clad layer 53 b of aprescribed thickness for magnetic shielding is formed over the wholesurface. Here, as the constituent material for the clad layer 53 b, amaterial having the same characteristics as the clad layer 51 isdesirable.

Further as shown in FIGS. 29( a) to 29(c), the clad layer 53 b isselectively removed so that the clad layer 53 b may be retained onlyover the Cu wire 37 b.

Successively as shown in FIGS. 30( a) to 30(c), a silicon nitride film55 is formed over the whole surface as a liner film for the Cu wire 37b. Thereafter as shown in FIGS. 31( a) to 31(c), an interlayerdielectric film 56 comprising SiO₂ or the like is formed over the wholesurface for example by the HDP-CVD method at a low temperature of 300°C. or lower, and thereby an MRAM having the memory cell sectioncomprising the lower electrode EB1, the MTJ device MD1, and the upperelectrode ET1 according to the first embodiment shown in FIGS. 1 to 31is completed.

(Method for Forming Silicon Nitride Film 55)

FIG. 32 is an explanatory view showing an expanded structure in thefocused region v2 and v3 at the memory cell section in FIGS. 30( a) and30(b).

As shown in the figure, the silicon nitride film 55 formed over the cladlayer 53 b is configured by the layered structure comprising a tensilestress silicon nitride film 55 p and a compressive stress siliconnitride film 55 c. This is hereunder described in detail.

Firstly, plasma treatment is applied with reducible NH₃ or H₂ aspretreatment before the silicon nitride film 55 is formed.

Thereafter, the tensile stress silicon nitride film 55 p to imposetensile stress on the MTJ device MD1 is formed over the clad layer 53 band the interlayer dielectric film 35 b where the clad layer 53 b is notformed.

Subsequently, the compressive stress silicon nitride film 55 c to imposecompressive stress on the MTJ device MD1 is formed over the tensilestress silicon nitride film 55 p.

An example of the conditions for forming the tensile stress siliconnitride film 55 p and the compressive stress silicon nitride film 55 cis as follows.

Firstly, a parallel plate type plasma CVD apparatus is used as theapparatus for forming the tensile stress silicon nitride film 55 p andthe compressive stress silicon nitride film 55 c. Then silane(SiH₄)/ammonia (NH₃)/nitrogen gas (N₂) are used as the film forming gas.

For example, the flow rates of SiH₄, NH₃, and N₂ can be set at 10 to 500(sccm), 10 to 500 (sccm), and 10 to 50,000 (sccm), respectively.

Further, the pressure during film forming is set at 1 to 21 (Torr), theelectrode interval between the parallel plates in the parallel platetype plasma CVD apparatus is set at 5 to 15 mm, and the RF power (13.56MHz) is set at 0.03 to 0.4 W/cm². Further, the film forming temperatureis set at 200° C. to 350° C. so as not to exert a bad influence on themagnetic property of the magnetic material for the MTJ device MD1.

Here, the upper limit of the temperature at which the electric andmagnetic properties of the magnetic material for the MTJ device MD1 arenot badly influenced is 300° C. in the case where the constituentmaterial for the tunnel dielectric film 7 configuring the MTJ device MD1is aluminum oxide (AlO_(x)) such as alumina (Al₂O₃) and 350° C. in thecase where the constituent material for the tunnel dielectric film 7 ismagnesium oxide (MgO).

Consequently, when the silicon nitride film 55 is formed inconsideration of the electric and magnetic properties of the magneticmaterial for the MTJ device, an ideal film forming temperature is in therange of 200° C. to 300° C. in the case where the constituent materialfor the tunnel dielectric film 7 configuring the MTJ device MD1 isAlO_(x) and in the range of 200° C. to 350° C. in the case where theconstituent material for the tunnel dielectric film 7 is MgO.

The reason why the upper limit of the temperature is different betweenAlO_(x) and MgO as the constituent material for the tunnel dielectricfilm 7 is as follows. AlO_(x) is used in the state of amorphous and MgOis used in the state of crystal as the tunnel dielectric film 7 (atunnel barrier). Consequently, annealing is required for crystallizationin the case of MgO and a temperature of about 350° C. is necessary asthe annealing temperature. If annealing temperature is raisedexcessively however, the magnetic property of the pin layer in the MTJdevice MD1 deteriorates. In consideration of the concern, the upperlimit of the temperature is set at 350° C. On the other hand, in thecase of AlO_(x), the material is used in the state of amorphous asstated above and hence annealing for crystallization is not required.Consequently, a low temperature process of about 300° C. is required andthus the upper limit of the temperature is set at 300° C.

In the range of the film forming conditions, the tensile stress and thecompressive stress of the formed silicon nitride film can easily be setand controlled by the method of setting the proportion of the gas flowrates of SiH₄, NH₃, and N₂ in the film forming gas, the pressure duringfilm forming, and others. For example, the compressive stress can beincreased by lowering the pressure during film forming and the tensilestress can be increased by raising the pressure during film forming.

(Effect)

The effect caused by forming the silicon nitride film 55 in the order offirstly the tensile stress silicon nitride film 55 p and then thecompressive stress silicon nitride film 55 c is hereunder explained.

In the case where only the tensile stress silicon nitride film 55 p isformed as the silicon nitride film 55, the deterioration of the magneticproperty in the MTJ device MD1 can be inhibited. The reason is that thetensile stress silicon nitride film 55 p can be formed with a low RFpower (0.4 W/cm² or lower) while the aforementioned film formingconditions are satisfied and hence the plasma damages imposed on the MTJdevice MD1 can be reduced.

In the case where only the tensile stress silicon nitride film 55 p isformed however, the reliability (EM (Electromigration), TDDB (TimeDependence on Dielectric Breakdown), and others) of the Cu wire 37lowers undesirably.

To cope with that, the compressive stress silicon nitride film 55 c isfurther formed over the tensile stress silicon nitride film 55 p. Thecompressive stress silicon nitride film 55 c has the function ofimproving the reliability such as EM, TDDB, and others of the Cu wire 37and hence the reliability of the Cu wire 37 can be improved.

Moreover, the compressive stress silicon nitride film 55 c can also beformed with a low RF power in the same way as the tensile stress siliconnitride film 55 p and hence it is possible to exhibit the effect ofinhibiting the deterioration of the magnetic property in the MTJ deviceMD1.

Further, in order to form the silicon nitride film 55 with a goodadhesiveness, it is necessary to deposit the silicon nitride film 55 inthe order of firstly the tensile stress silicon nitride film 55 p andthen the compressive stress silicon nitride film 55 c.

One of the reasons is presumably that, since the tensile stress siliconnitride film 55 p has a low density and is vulnerable in nature, it ispossible to prevent the tensile stress silicon nitride film 55 p fromabsorbing moisture by covering the surface thereof with the compressivestress silicon nitride film 55 c of a high density.

Another reason is as follows. Whereas the tensile stress silicon nitridefilm 55 p is excellent in adhesiveness with a conductive layer such asCu or iron, cobalt, or nickel used for a clad layer but is inferior inadhesiveness with an interlayer dielectric film in comparison with thecompressive stress silicon nitride film 55 c, the compressive stresssilicon nitride film 55 c is inferior in adhesiveness with a conductivelayer but is excellent in adhesiveness with an interlayer dielectricfilm in comparison with the tensile stress silicon nitride film 55 p.Consequently, the compressive stress silicon nitride film 55 c isexcellent in adhesiveness with an interlayer dielectric film as an upperlayer and also the tensile stress silicon nitride film 55 p is excellentin adhesiveness with the clad layer 53 b, and hence exfoliation can beinhibited effectively. It is estimated that, for that reason, thetensile stress silicon nitride film 55 p and the compressive stresssilicon nitride film 55 c function so as to compensate the drawbacks ofeach other.

Further, in the case where the silicon nitride film 55 comprises onlythe compressive stress silicon nitride film 55 c, it is concerned thatexfoliation may occur at a portion, having a poorer adhesiveness, of alayer under the compressive stress silicon nitride film 55 c. In thefirst embodiment however, since the tensile stress silicon nitride film55 p is formed under the compressive stress silicon nitride film 55 c inthe silicon nitride film 55, the concern can be avoided effectively.

If the tensile stress silicon nitride film 55 p is too thick, thereliability of the Cu wire 37 deteriorates. It is desirable therefore toform the compressive stress silicon nitride film 55 c so as to bethicker than the tensile stress silicon nitride film 55 p. A conceivableexample is that the thickness of the tensile stress silicon nitride film55 p is set at not more than 20% of the total thickness of the siliconnitride film 55 and the thickness of the compressive stress siliconnitride film 55 c is set at not less than 80% of the total thickness.

It is possible to increase the reliability of the Cu wire 37 withoutfail by forming the compressive stress silicon nitride film 55 c thickerthan the tensile stress silicon nitride film 55 p.

FIG. 33 is a graph showing the relationship between an RF power that isone of the film forming conditions used when the silicon nitride film 55(the tensile stress silicon nitride film 55 p and the compressive stresssilicon nitride film 55 c) is formed and a switching current variationof the MTJ device MD1. In the figure, the RF power is shown along thehorizontal axis and the writing current variation (a.u. (arbitraryunit)) is shown along the vertical axis.

As shown in the figure, it is understood that, even in the case wherethe RF power is in the vicinity of 0.4 (W/cm²) that is the maximum RFpower in the film forming condition, the variation can be suppressed by60% or more in comparison with the case where the RF power is about 1.6(W/cm²).

In this way, it is possible to effectively inhibit the magnetic propertyof the MTJ device MD1 from deteriorating by forming the silicon nitridefilm 55 with a relatively low RF power (maximum 0.4 and ideally 0.1(W/cm²)).

In this way, in the MRAM according to the first embodiment, the siliconnitride film 55 of the layered structure comprising the tensile stresssilicon nitride film 55 p and the compressive stress silicon nitridefilm 55 c is formed over the clad layer 53 b configuring the upperwiring section together with the Cu wire 37 b, namely over the upperwiring section. On this occasion, the tensile stress silicon nitridefilm 55 p is formed first and thereafter the compressive stress siliconnitride film 55 c is formed.

Since both the tensile stress silicon nitride film 55 p and thecompressive stress silicon nitride film 55 c can be formed under thefilm forming condition of a relatively low RF power, it is possible tominimize damages to the MTJ device MD1 and thereby to avoid an adverseinfluence on the properties of the magnetic films (the lower magneticfilm 6 and the upper magnetic film 8) in the MTJ device MD1.

Further, since the compressive stress silicon nitride film 55 c havingthe function of improving the reliability of the Cu wire 37 is formed,it is possible to improve the reliability of the upper wiring section.

Furthermore, by forming the tensile stress silicon nitride film 55 pfirst and then forming the compressive stress silicon nitride film 55 c,it is possible to form the silicon nitride film 55 with a goodadhesiveness over the clad layer 53 b and the interlayer dielectric film35 b.

Yet further, it is ideal that the tensile stress silicon nitride film 55p has a tensile stress of 300 MPa or more and the compressive stresssilicon nitride film 55 c has a compressive stress of 1,000 MPa or more.By forming the tensile stress silicon nitride film 55 p and thecompressive stress silicon nitride film 55 c having such a tensilestress and a compressive stress respectively, it is possible to improvethe reliability of the Cu wire 37 more consistently while the filmforming temperature is satisfied.

Moreover, by forming the tensile stress silicon nitride film 55 p andthe compressive stress silicon nitride film 55 c under the film formingcondition of 350° C. or lower, it is possible to inhibit the propertiesof the magnetic film in the MTJ device MD1 from being adverselyinfluenced by the film forming temperatures of the tensile stresssilicon nitride film 55 p and the compressive stress silicon nitridefilm 55 c.

In addition, since plasma treatment is applied with reducible NH₃ or H₂as pretreatment before the tensile stress silicon nitride film 55 p andthe compressive stress silicon nitride film 55 c are formed, it ispossible to enhance adhesiveness when the tensile stress silicon nitridefilm 55 p and the compressive stress silicon nitride film 55 c areformed successively.

Second Embodiment

FIGS. 34( a) to 34(c) are sectional views showing the structure of anMRAM according to the second embodiment of the present invention. InFIGS. 34( a) to 34(c), FIG. 34( a) represents a sectional view taken online X-X in FIG. 21, FIG. 34( b) represents a sectional view taken online Y-Y in FIG. 21, and FIG. 34( c) represents a cross-sectionalstructure at a periphery circuit section different from a memory cellsection.

The MRAM according to the second embodiment differs from the firstembodiment in that the silicon nitride film 55 is not formed over theclad layer 53 b unlike the first embodiment but is selectively formedonly over the interlayer dielectric film 35 b where the clad layer 53 bis not formed.

A method for manufacturing an MRAM according to the second embodiment isexplained hereunder. The MRAM is manufactured in the same way as thefirst embodiment until the structure shown in FIGS. 30( a) to 30(c) isobtained.

Thereafter as shown in FIGS. 34( a) to 34(c), a silicon nitride film 55is formed over the whole surface, the silicon nitride film 55 over theCu wire 37 b is selectively removed, and thereafter a clad layer 53 b isselectively formed over the Cu wire 37 b. Then an interlayer dielectricfilm 56 comprising SiO₂ is formed over the whole surface and the MRAMaccording to the second embodiment shown in FIGS. 34( a) to 34(c) iscompleted.

In this way, in the MRAM according to the second embodiment, the siliconnitride film 55 of the layered structure comprising the tensile stresssilicon nitride film 55 p and the compressive stress silicon nitridefilm 55 c is formed over the interlayer dielectric film 35 b includingthe region in the vicinity of the upper wiring section where the upperwiring section comprising the Cu wire 37 b and the clad layer 53 b isnot formed.

As a result, in the MRAM according to the second embodiment, it ispossible to increase the reliability of the upper wiring section withoutadverse effects on the properties of the magnetic film in the MTJ deviceMD1 in the same way as the first embodiment.

Third Embodiment

FIGS. 35( a) to 35(c) are sectional views showing the structure of anMRAM according to the third embodiment of the present invention. FIG.35( a) represents a sectional view taken on line X-X in FIG. 21, theFIG. 35( b) represents a sectional view taken on line Y-Y in FIG. 21,and FIG. 35( c) represents a cross-sectional structure at a peripherycircuit section different from a memory cell section.

The MRAM according to the third embodiment differs from the firstembodiment in that the clad layers 53 a and 53 b are not formed unlikethe first embodiment.

A method for manufacturing an MRAM according to the third embodiment isexplained hereunder. The MRAM is manufactured in the same way as thefirst and second embodiments until the structure shown in FIGS. 24( a)to 24(c) is obtained.

Thereafter as shown in FIGS. 27( a) to 27(c) (note that the clad layer53 b does not exist), a bit line is obtained by embedding a Cu wire 37 binto a trench 36 and forming the Cu wire 37 b. As a result, the Cu wire37 b in the memory cell section (FIGS. 27( a) and 27(b)) is electricallycoupled to the upper electrode ET1 in the MTJ device MD1 through the Cuwire 37 a. In the same way, the Cu wire 37 b in the peripheral circuitsection (FIG. 27( c)) is electrically coupled to the Cu wire 25 throughthe Cu wire 37 a. In this way, the Cu wire 37 (37 a and 37 b) is formedas a fourth layered metal wire.

Here, a method of forming the Cu wires 37 a and 37 b simultaneously bythe damascene technology after the via hole 40 (40 p) and the trench 36are formed in place of the processes shown in FIGS. 22 to 24 and 27 isalso conceivable.

Successively as shown in FIGS. 35( a) to 35(c), after a silicon nitridefilm 55 is formed over the whole surface, an interlayer dielectric film56 comprising SiO₂ is formed over the whole surface and the MRAMaccording to the third embodiment shown in FIGS. 35( a) to 35(c) iscompleted.

In this way, in the MRAM according to the third embodiment, the siliconnitride film 55 of the layered structure comprising the tensile stresssilicon nitride film 55 p and the compressive stress silicon nitridefilm 55 c is formed over the Cu wire 37 b configuring the upper wiringsection by itself.

As a result, in the MRAM according to the third embodiment, it ispossible to increase the reliability of the upper wiring section withoutadverse effects on the properties of the magnetic film in the MTJ deviceMD1 in the same way as the first embodiment.

FIGS. 36( a) to 36(c) are sectional views showing a modified example ofthe structure of an MRAM according to the third embodiment of thepresent invention. In FIGS. 36( a) to 36(c), FIG. 36( a) represents asectional view taken on line X-X in FIG. 21, FIG. 36( b) represents asectional view taken on line Y-Y in FIG. 21, and FIG. 36( c) representsa cross-sectional structure at a periphery circuit section differentfrom a memory cell section.

As shown in FIGS. 36( a) to 36(c), in the modified example of the thirdembodiment, after a silicon nitride film 55 comprising a tensile stresssilicon nitride film 55 p and a compressive stress silicon nitride film55 c is formed, a clad layer 53 b is formed over the silicon nitridefilm 55 so as to cover the Cu wire 37 b in a plan view. On thisoccasion, the whole Cu wire 37 b may be completely covered or only apart of the Cu wire 37 b may be covered with the silicon nitride film55.

In this way, in the MRAM according to the modified example of the thirdembodiment, the silicon nitride film 55 of the layered structurecomprising the tensile stress silicon nitride film 55 p and thecompressive stress silicon nitride film 55 c is formed over the Cu wire37 b configuring the upper wiring section by itself.

As a result, in the MRAM according to the modified example of the thirdembodiment, it is possible to increase the reliability of the upperwiring section without adverse effects on the properties of the magneticfilm in the MTJ device MD1 in the same way as the first embodiment.

Further, in the MRAM according to the modified example of the thirdembodiment, the Cu wire 37 b is covered with the clad layer 53 b whilethe silicon nitride film 55 is interposed in between.

That is, in the modified example of the third embodiment, since the cladlayer 53 b is formed over the silicon nitride film 55 whereas the cladlayer 53 b is formed under the silicon nitride film 55 in the firstembodiment, it is possible to reduce damages of plasma entering the MTJdevice section, the Cu wire 37 b, and others when the clad layer isformed by the sputtering method or when the clad layer is selectivelyremoved by the dry etching method.

Further, in the modified example of the third embodiment, unlike thesecond embodiment, it is possible to reduce damages of plasma enteringthe MTJ device section, the Cu wire 37 b, and others when the clad layeris formed by the sputtering method and also it is possible to reducedamages of plasma entering the MTJ device section, the Cu wire 37 b, andothers when the silicon nitride film 55 over the Cu wire 37 b isselectively removed.

1. A semiconductor device comprising: an MTJ device section being formedabove a semiconductor substrate and including magnetic films; an upperwiring section formed above said MTJ device section and electricallycoupled to said MTJ device section; a first silicon nitride film formedover said upper wiring section and at least a part of a region in thevicinity thereof; and a second silicon nitride film formed over saidfirst silicon nitride film, wherein said first silicon nitride filmincludes a tensile stress silicon nitride film to impose tensile stresson said MTJ device section, and wherein said second silicon nitride filmincludes a compressive stress silicon nitride film to impose compressivestress on said MTJ device section.
 2. A semiconductor device accordingto claim 1, wherein said first silicon nitride film includes a tensilestress silicon nitride film the tensile stress of which imposed on saidMTJ device section is 300 MPa or more in absolute value, and whereinsaid second silicon nitride film includes a compressive stress siliconnitride film the compressive stress of which imposed on said MTJ devicesection is 1,000 MPa or more in absolute value.
 3. A semiconductordevice according to claim 1, wherein said second silicon nitride filmincludes a second silicon nitride film the thickness of which is largerthan the thickness of said first silicon nitride film.
 4. Asemiconductor device according to claim 1, wherein said upper wiringsection includes: a main wiring section; and a clad layer formed oversaid main wiring section, and wherein said first silicon nitride film isformed over said clad layer.
 5. A semiconductor device according toclaim 1, wherein said semiconductor device includes a clad layer beingformed over said second silicon nitride film and covering said upperwiring section in a plan view.
 6. A semiconductor device according toclaim 1, wherein said semiconductor device further comprises aninterlayer dielectric film formed so as to cover said MTJ devicesection, wherein said interlayer dielectric film has a first dielectricregion including the whole MTJ device section and a second dielectricregion formed over said first dielectric region, wherein said upperwiring section includes: a main wiring section formed so as to beselectively embedded into said second dielectric region and electricallycoupled to said MTJ device section in the manner of penetrating throughsaid first dielectric region; and a clad layer formed over said mainwiring section and wherein said first silicon nitride film is formedover said second dielectric region including the region in the vicinityof said upper wiring section where said upper wiring section is notformed.
 7. A semiconductor device according to claim 1, wherein saidupper wiring section includes a main wiring section, and wherein saidfirst silicon nitride film is formed over said main wiring section.
 8. Amanufacturing method of a semiconductor device, comprising the steps of:(a) selectively forming an MTJ device section including magnetic filmsover a semiconductor substrate; (b) forming an upper wiring sectionabove said MTJ device section so as to be electrically coupled to saidMTJ device section; (c) forming a first silicon nitride film over saidupper wiring section and a region in the vicinity thereof; and (d)forming a second silicon nitride film over said first silicon nitridefilm, wherein said step (c) includes a step of forming a tensile stresssilicon nitride film to impose tensile stress on said MTJ device sectionas said first silicon nitride film, and wherein said step (d) includes astep of forming a compressive stress silicon nitride film to imposecompressive stress on said MTJ device section as said second siliconnitride film.
 9. A manufacturing method of a semiconductor deviceaccording to claim 8, wherein each of said steps (c) and (d) includes astep executed by satisfying the temperature condition of 350° C. orlower.
 10. A manufacturing method of a semiconductor device according toclaim 8, further comprising a step of: (e) after said step (b) beforesaid step (c), applying plasma treatment with a reducing gas.
 11. Amanufacturing method of a semiconductor device according to claim 8,wherein each of said steps (c) and (d) includes a step of applying theCVD method under the film forming condition of an RF power of 0.4(W/cm²) or lower.
 12. A manufacturing method of a semiconductor deviceaccording to claim 8, wherein said step (c) includes a step of forming atensile stress silicon nitride film the tensile stress of which imposedon said MTJ device section is 300 MPa or more in absolute value as saidfirst silicon nitride film, and wherein said step (d) includes a step offorming a compressive stress silicon nitride film the compressive stressof which imposed on said MTJ device section is 1,000 MPa or more inabsolute value as said second silicon nitride film.
 13. A manufacturingmethod of a semiconductor device according to claim 8, wherein said step(d) includes a step of forming said second silicon nitride film having athickness larger than the thickness of said first silicon nitride film.14. A manufacturing method of a semiconductor device according to claim8, wherein said step (b) includes the steps of: (b-1) forming a mainwiring section so as to be electrically coupled to said MTJ device; and(b-2) forming a clad layer over said main wiring section, wherein saidupper wiring section includes said main wiring section and said cladlayer, and wherein said step (c) includes a step of forming said firstsilicon nitride film over said clad layer.
 15. A manufacturing method ofa semiconductor device according to claim 8, wherein said step (b)includes the steps of: (b-1) forming an interlayer dielectric film so asto cover said MTJ device section, said interlayer dielectric film havinga first dielectric region including the whole MTJ device section and asecond dielectric region formed over said first dielectric region; and(b-2) forming a main wiring section selectively embedded into saidsecond dielectric region and electrically coupled to said MTJ device inthe manner of selectively penetrating through said first dielectricregion, wherein said manufacturing method of a semiconductor devicefurther comprises the steps of: (f) after said step (d), selectivelyremoving said first and second silicon nitride films over said upperwiring section; and (g) selectively forming a clad layer over said mainwiring section, and wherein said upper wiring section includes said mainwiring section and said clad layer.
 16. A manufacturing method of asemiconductor device according to claim 8, wherein said step (b)includes a step of forming a main wiring section so as to beelectrically coupled to said MTJ device, wherein said upper wiringsection includes only said main wiring section, and wherein said step(c) includes a step of forming said first silicon nitride film over saidmain wiring section.
 17. A manufacturing method of a semiconductordevice according to claim 8, further comprising a step of: (h) forming aclad layer covering said upper wiring section in a plan view over saidsilicon nitride film.